KLA Tools Guide [Reticle Inspection to Fab-Wide Process Control]
Averroes
Jun 26, 2025
There’s no shortage of KLA tools out there but figuring out what each one does (and why it matters) isn’t always straightforward.
Between wafer inspection, e-beam review, metrology, and full-stack control, it’s easy to lose track.
We’ll break down the core systems. How they work, where they’re used, and what role they play across inspection and process control in the fab.
Key Notes
There are 5 core categories of KLA tools: reticle inspection, patterned/unpatterned wafer inspection, e-beam review, metrology.
Teron Series prevents costly yield loss by catching EUV reticle defects.
CIRCL cluster systems inspect wafer front, back, and edge simultaneously.
E-beam tools (eDR7xxx, eS800) detect electrical defects that optical systems miss.
What Are KLA Tools?
KLA instruments refer to a wide portfolio of inspection, review, metrology, and process control systems used throughout semiconductor manufacturing.
These tools aren’t one-size-fits-all. They range from reticle inspection systems that scan photomasks for killer defects, to electron-beam review platforms that image nanometer-scale anomalies, to cluster tools that scan the entire wafer surface – front, back, and edge.
Broadly, KLA tools fall into:
Reticle Inspection Tools
Patterned and Unpatterned Wafer Inspection Systems
E-Beam Review and Inspection Tools
Process Metrology Equipment
Software & Fab-Wide Control Platforms
KLA Reticle Inspection Tools (Teron Series)
Photomasks are foundational. If the mask is flawed, every die printed with it could carry the same defect.
These tools detect particles, pattern anomalies, and placement errors on both EUV and optical reticles.
Notable Models:
Teron 640e: Gold standard for 7nm and 5nm EUV/193nm reticle inspection
Teron SL670e/XP: High-throughput models designed for volume EUV mask manufacturing
Teron SL650 & 611: Fab-based reticle QC systems for incoming inspection and degradation monitoring
Key features include STARlight technology for die-to-die and die-to-database inspections, EUVGold™ algorithms for multilayer masks, and connectivity to KLA’s e-beam review platforms.
These systems help mask shops and fabs prevent costly yield loss from reticle-induced defects.
Patterned Wafer Inspection Tools: Puma & 2900 Series
After reticles, wafers go through layer after layer of complex processing. That’s where patterned wafer inspection comes in.
Puma Series (Puma 9650, 9980)
Puma tools use narrowband laser scanning to identify particles, bridges, residues, and pattern anomalies in critical areas like SRAM edges and memory transition zones.
The Puma 9980 integrates design-aware capabilities and pairs seamlessly with e-beam systems for deeper analysis.
2900 Series
The 2900 Series uses broadband illumination to inspect early process and backend layers.
It delivers ADI sensitivity on par with AEI and leverages machine learning algorithms like MCAT iDO™ 3.0 for smarter classification.
It’s especially useful for new logic devices and advanced memory architectures.
Together, these tools enable fabs to catch defects early, fine-tune processes, and reduce manual reinspection.
Unpatterned Wafer Inspection: Surfscan Series
You can’t build anything reliable on a flawed substrate.
The Surfscan Series handles unpatterned wafer inspection – identifying scratches, sliplines, residues, and particles on bare wafers or films.
The SP7XP model, for example, delivers 12.5nm sensitivity, uses multiple illumination modes (normal and phase contrast), and integrates AI classification via IBC and the Z7™ engine.
It’s especially critical for incoming quality control of silicon, SiC, and GaN wafers, and plays a key role across mature and sub-5nm nodes alike.
Electron-Beam Review and Deep Inspection: eDR7xxx & eS800
When optical tools spot something suspicious, e-beam review fills in the details.
eDR7xxx Series (eDR7380)
These are high-resolution defect review systems that use Simul-6 technology to capture multiple signal types in a single scan.
That means faster excursion detection, better root cause analysis, and tighter feedback loops.
eS800 Series
The eS800 takes it a step further: not just review, but inspection.
With TurboScan and voltage contrast imaging, it can detect electrical defects like opens and shorts, and identify physical defects inside deep trenches and vias.
These capabilities are essential for advanced memory (DRAM, 3D NAND) and logic devices.
Fab-Wide Inspection and Control: CIRCL™ Series
CIRCL is the centerpiece of KLA’s fab-wide control approach. It’s a modular cluster system that inspects the front, back, and edge of the wafer simultaneously.
It combines defect inspection, metrology, and review within one footprint.
Features like DirectedSampling™ trigger smart, cross-module measurements. When a defect is found on the front side, edge profile or backside inspection can be triggered automatically – saving time and improving traceability.
Compared to niche inspection tools, CIRCL is built for scale: high throughput, parallel operation, and broad coverage.
Metrology Tools Supporting Process Control
Inspection tools are just half the story.
KLA’s metrology systems measure film thickness, CD, overlay error, edge bead, and more.
Some Key Systems:
SpectraFilm™ / SpectraShape™: Film and shape metrology
Axion®: X-ray CD and profile measurement
SensArray®: In-situ temperature and tool environment monitoring
Surfscan®: Also supports process monitoring for incoming wafers
These metrology systems provide the data that fabs need to optimize etch, deposition, and litho steps at scale.
The Software Backbone: Yield Platforms & Data Analytics
All that inspection and metrology data feeds into KLA’s yield and analytics platforms:
Klarity®: Centralizes defect/yield data across the fab
OVALiS / 5D Analyzer: Real-time diagnostics, excursion detection, and SPC
RDC (Reticle Decision Center): Litho analysis and reticle-related defect disposition
AI and machine learning play a central role here – from classifying defect images to identifying spatial signatures and predicting excursions before they cause downtime.
Why KLA Remains Core to Advanced Semiconductor Manufacturing
KLA doesn’t just offer tools. It offers infrastructure.
Its systems span the entire semiconductor lifecycle:
R&D: Early process feedback and design yield optimization
Ramp: Accelerated yield learning and debug
High-Volume Manufacturing: Scalable, fab-wide quality control
And with tools deeply embedded in process flows and MES systems, switching is no small feat, making KLA not only essential but sticky.
Supercharge Inspection Without New Hardware
Achieve 99%+ accuracy using your existing KLA tools.
Frequently Asked Questions
How do KLA tools integrate with existing fab MES systems?
KLA tools use standard interfaces like SECS/GEM to integrate with manufacturing execution systems. This allows real-time data exchange, automated workflows, and tight feedback loops across inspection, metrology, and production tools.
Can KLA inspection tools detect new, unknown defect types?
Yes. Many tools, like the Puma Series and CIRCL, incorporate AI/ML algorithms that go beyond template matching, enabling detection of previously unseen or novel defects without manual reprogramming.
What’s the difference between defect inspection and metrology?
Defect inspection identifies anomalies (like particles or pattern defects), while metrology measures process parameters like CD, overlay, or film thickness. Both are critical for process control but serve different objectives.
How scalable are KLA tools for multi-fab operations?
KLA’s platforms are designed with fleet consistency, centralized recipe management, and cloud-based analytics in mind, making them well-suited for deployment across multiple fabs with minimal duplication of effort.
Conclusion
KLA tools play a major role in how leading fabs detect, review, and manage defects – from early-stage reticle issues to full-surface wafer inspection.
Systems like the 2900 Series, Puma, Surfscan, CIRCL, and e-beam platforms each serve a specific purpose, but they share a common goal: keep quality high and yield moving in the right direction.
Tying those systems together and making their output actionable is where the real challenge starts.
If you’re investing in inspection tools, Averroes helps you get more from them – faster decisions, smarter models, and no extra hardware. Book a free demo to see how we turn inspection into impact.
![KLA Tools Guide [Reticle Inspection to Fab-Wide Process Control]](/_next/image?url=https%3A%2F%2Fhvp.44e.myftpupload.com%2Fwp-content%2Fuploads%2F2025%2F06%2FAverroes.ai-Blog-Covers-JA-8-1-1.png&w=3840&q=75)
There’s no shortage of KLA tools out there but figuring out what each one does (and why it matters) isn’t always straightforward.
Between wafer inspection, e-beam review, metrology, and full-stack control, it’s easy to lose track.
We’ll break down the core systems. How they work, where they’re used, and what role they play across inspection and process control in the fab.
Key Notes
What Are KLA Tools?
KLA instruments refer to a wide portfolio of inspection, review, metrology, and process control systems used throughout semiconductor manufacturing.
These tools aren’t one-size-fits-all. They range from reticle inspection systems that scan photomasks for killer defects, to electron-beam review platforms that image nanometer-scale anomalies, to cluster tools that scan the entire wafer surface – front, back, and edge.
Broadly, KLA tools fall into:
KLA Reticle Inspection Tools (Teron Series)
Photomasks are foundational. If the mask is flawed, every die printed with it could carry the same defect.
KLA’s Teron Series is built for precisely this reason.
These tools detect particles, pattern anomalies, and placement errors on both EUV and optical reticles.
Notable Models:
Key features include STARlight technology for die-to-die and die-to-database inspections, EUVGold™ algorithms for multilayer masks, and connectivity to KLA’s e-beam review platforms.
These systems help mask shops and fabs prevent costly yield loss from reticle-induced defects.
Patterned Wafer Inspection Tools: Puma & 2900 Series
After reticles, wafers go through layer after layer of complex processing. That’s where patterned wafer inspection comes in.
Puma Series (Puma 9650, 9980)
Puma tools use narrowband laser scanning to identify particles, bridges, residues, and pattern anomalies in critical areas like SRAM edges and memory transition zones.
The Puma 9980 integrates design-aware capabilities and pairs seamlessly with e-beam systems for deeper analysis.
2900 Series
The 2900 Series uses broadband illumination to inspect early process and backend layers.
It delivers ADI sensitivity on par with AEI and leverages machine learning algorithms like MCAT iDO™ 3.0 for smarter classification.
It’s especially useful for new logic devices and advanced memory architectures.
Together, these tools enable fabs to catch defects early, fine-tune processes, and reduce manual reinspection.
Unpatterned Wafer Inspection: Surfscan Series
You can’t build anything reliable on a flawed substrate.
The Surfscan Series handles unpatterned wafer inspection – identifying scratches, sliplines, residues, and particles on bare wafers or films.
The SP7XP model, for example, delivers 12.5nm sensitivity, uses multiple illumination modes (normal and phase contrast), and integrates AI classification via IBC and the Z7™ engine.
It’s especially critical for incoming quality control of silicon, SiC, and GaN wafers, and plays a key role across mature and sub-5nm nodes alike.
Electron-Beam Review and Deep Inspection: eDR7xxx & eS800
When optical tools spot something suspicious, e-beam review fills in the details.
eDR7xxx Series (eDR7380)
These are high-resolution defect review systems that use Simul-6 technology to capture multiple signal types in a single scan.
That means faster excursion detection, better root cause analysis, and tighter feedback loops.
eS800 Series
The eS800 takes it a step further: not just review, but inspection.
With TurboScan and voltage contrast imaging, it can detect electrical defects like opens and shorts, and identify physical defects inside deep trenches and vias.
These capabilities are essential for advanced memory (DRAM, 3D NAND) and logic devices.
Fab-Wide Inspection and Control: CIRCL™ Series
CIRCL is the centerpiece of KLA’s fab-wide control approach. It’s a modular cluster system that inspects the front, back, and edge of the wafer simultaneously.
It combines defect inspection, metrology, and review within one footprint.
Features like DirectedSampling™ trigger smart, cross-module measurements. When a defect is found on the front side, edge profile or backside inspection can be triggered automatically – saving time and improving traceability.
CIRCL-AP adds support for advanced packaging lines.
Compared to niche inspection tools, CIRCL is built for scale: high throughput, parallel operation, and broad coverage.
Metrology Tools Supporting Process Control
Inspection tools are just half the story.
KLA’s metrology systems measure film thickness, CD, overlay error, edge bead, and more.
Some Key Systems:
These metrology systems provide the data that fabs need to optimize etch, deposition, and litho steps at scale.
The Software Backbone: Yield Platforms & Data Analytics
All that inspection and metrology data feeds into KLA’s yield and analytics platforms:
AI and machine learning play a central role here – from classifying defect images to identifying spatial signatures and predicting excursions before they cause downtime.
Why KLA Remains Core to Advanced Semiconductor Manufacturing
KLA doesn’t just offer tools. It offers infrastructure.
Its systems span the entire semiconductor lifecycle:
And with tools deeply embedded in process flows and MES systems, switching is no small feat, making KLA not only essential but sticky.
Supercharge Inspection Without New Hardware
Achieve 99%+ accuracy using your existing KLA tools.
Frequently Asked Questions
How do KLA tools integrate with existing fab MES systems?
KLA tools use standard interfaces like SECS/GEM to integrate with manufacturing execution systems. This allows real-time data exchange, automated workflows, and tight feedback loops across inspection, metrology, and production tools.
Can KLA inspection tools detect new, unknown defect types?
Yes. Many tools, like the Puma Series and CIRCL, incorporate AI/ML algorithms that go beyond template matching, enabling detection of previously unseen or novel defects without manual reprogramming.
What’s the difference between defect inspection and metrology?
Defect inspection identifies anomalies (like particles or pattern defects), while metrology measures process parameters like CD, overlay, or film thickness. Both are critical for process control but serve different objectives.
How scalable are KLA tools for multi-fab operations?
KLA’s platforms are designed with fleet consistency, centralized recipe management, and cloud-based analytics in mind, making them well-suited for deployment across multiple fabs with minimal duplication of effort.
Conclusion
KLA tools play a major role in how leading fabs detect, review, and manage defects – from early-stage reticle issues to full-surface wafer inspection.
Systems like the 2900 Series, Puma, Surfscan, CIRCL, and e-beam platforms each serve a specific purpose, but they share a common goal: keep quality high and yield moving in the right direction.
Tying those systems together and making their output actionable is where the real challenge starts.
If you’re investing in inspection tools, Averroes helps you get more from them – faster decisions, smarter models, and no extra hardware. Book a free demo to see how we turn inspection into impact.