Film Thickness Measurement with Deep Learning
in Semiconductor Manufacturing
Leveraging Advanced AI to Ensure Precise Film Application and Uniformity Across Dies
Image-Based Metrology Enhancements
Analyze images captured during film deposition to assess film thickness and uniformity with high precision, detecting even subtle variations that might not be visible to traditional methods.
Automated Die Distribution Analysis
Analyze the distribution of film thickness across individual dies on a wafer. Ensures uniform material deposition, which is critical for maintaining consistency in device performance across the entire wafer.
Real-Time Thickness Monitoring
Employs specialized Deep Learning models to process metrology data in real time. This allows for immediate feedback to deposition equipment, enabling dynamic adjustments to the film application process to correct any detected anomalies or deviations.
Continuously Learns from Data
Unlike traditional, expensive software 1.0 based equipment, our Automated Defect Segmentation bespoke model learns from data and improves accuracy using Averroes' Active Learning feature.
Privacy and Security
Choose On-Premise for Privacy, Speed, and Security, or Cloud for Scalability and Performance. We're Cloud-Agnostic, ensuring seamless integration and flexibility.
We've experienced a remarkable 40-60% increase in submicron defect detection. Averroes has saved us over 300 hours/month/app of labor and increased our productivity by more than 30% .
Automation Manager
@
Semiconductor OEM
Frequently asked questions
No. Averroes functions seamlessly on existing visual inspection equipment, whether it's KLA Tencor, AOI, or Onto equipment. No additional hardware purchase is needed.
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