KLA’s inspection systems are some of the most widely used in advanced semiconductor manufacturing. And for good reason.
From bright-field to e-beam, each tool is built to solve a specific inspection challenge.
But knowing which system to use (and when) isn’t always straightforward. And while their tech is impressive, many still rely on template matching under the hood.
We’ll break down how KLA’s Bright-Field, Multi-Beam, and E-Beam inspection systems compare, where each one fits in the fab, and how integrating AI can close the gaps they leave behind.
Key Notes
Bright-field excels at full-wafer coverage but limited to ~20-30nm defect detection.
E-beam achieves 1-3nm sensitivity for nanoscale precision but slower throughput.
KLA’s single-beam approach outperforms traditional multi-beam complexity and calibration issues.
AI integration reduces false positives to <3% without hardware changes.
KLA’s Role in Defect Inspection
KLA inspection systems are used across every stage of the semiconductor manufacturing flow:
Incoming tool qualification
Wafer qualification
R&D and process development
Inline line and tool monitoring
Their systems are known for balancing sensitivity, speed, and accuracy. Whether it’s a full wafer scan or pinpoint hotspot inspection, KLA has a system tuned to the task.
The product lineup spans optical platforms like the 281x series, advanced electron-beam systems like the eSL10, and integrated solutions that pair inspection with AI-driven classification and design-aware review.
Bright-Field Inspection: The Fab Workhorse
How It Works
KLA’s Bright-Field systems use reflected light to detect defects. A broadband plasma light source shines directly on the wafer. Defect-free areas reflect light evenly, while anomalies scatter or absorb light – showing up as contrast changes.
Systems like the 2810, 2815, and 392x use tunable broadband illumination (DUV through visible), meaning they can adapt the inspection wavelength to the wafer material and layer type, enhancing contrast.
Used for trend monitoring, excursion alerts, and tool health
E-Beam:
High-res images with nanometer-scale defect morphology
Voltage contrast to reveal electrical defects (opens, shorts, voids)
Deep insights for failure analysis and process tweaks
Together, they give a full picture: where defects are happening, why, and how to stop them.
When to Use What (& Why You Need All Three)
Scenario
Best Fit
Routine fab monitoring
Bright-Field
Voltage contrast defects
E-Beam
Sub-3nm node process development
E-Beam / Multi-Beam
Wafer qualification (full coverage)
Bright-Field
Hotspot or critical area inspection
E-Beam
Fabs typically layer inspection strategies:
Bright-field for broad coverage
AI to flag suspect wafers or layers
E-beam for deep dive analysis
How AI Enhances KLA Defect Inspection
Most KLA tools still rely heavily on template matching. That works – but it’s limited.
At Averroes.ai, we add an intelligent layer that goes further:
Learns from real production data (no reprogramming needed)
Reduces false positives to <3%
Works with just 20–40 images per defect class
Processes results in real time
The best part is that it integrates with KLA AOI and e-beam systems without requiring any hardware changes.
So you keep the equipment, but upgrade the intelligence.
Make KLA Defect Inspection Even More Powerful
Achieve 99% accuracy with AI that plugs right in.
Frequently Asked Questions
How does KLA’s inspection approach differ from competitors like Applied Materials or ASML?
KLA focuses heavily on inspection and metrology, with deep investment in both optical and e-beam technologies. Unlike competitors, KLA offers more comprehensive defect classification, stronger integration with design data, and AI insights across its portfolio.
Can KLA systems inspect both front-end and back-end process layers?
Yes, KLA’s platforms are designed to inspect front-side, back-side, and edge defects across all process stages, from initial patterning to final packaging layers, making them suitable for full-flow process monitoring.
Are KLA’s inspection tools compatible with heterogeneous integration or chiplet-based designs?
They are increasingly being adapted for such use cases. Tools like the eSL10 can analyze complex 3D interconnects, high-aspect ratio trenches, and multi-die stacks used in advanced packaging and heterogeneous integration.
How often do fabs need to recalibrate or update KLA inspection recipes?
Recipe tuning typically occurs during process development or when defect trends shift. KLA tools support rapid recipe optimization, and AI helps minimize manual adjustments, but high-volume fabs may still recalibrate periodically for accuracy.
Conclusion
KLA’s defect inspection systems each serve a clear role. Bright-field for speed and full-wafer coverage, e-beam for nanoscale precision, and their multi-beam approach to close the gap between sensitivity and throughput.
None of them are one-size-fits-all, but together they give fabs a layered strategy to catch more defects, faster, and with fewer false alarms.
And when paired with smart AI, the inspection data becomes more than raw output – it becomes a tool for real-time decisions that actually move the needle on yield and efficiency.
If you’re using KLA (or any AOI system), Averroes.ai plugs in to help you cut false positives, reach 99% accuracy, and make better calls without touching your existing setup. Book a free demo to see how.
KLA’s inspection systems are some of the most widely used in advanced semiconductor manufacturing. And for good reason.
From bright-field to e-beam, each tool is built to solve a specific inspection challenge.
But knowing which system to use (and when) isn’t always straightforward. And while their tech is impressive, many still rely on template matching under the hood.
We’ll break down how KLA’s Bright-Field, Multi-Beam, and E-Beam inspection systems compare, where each one fits in the fab, and how integrating AI can close the gaps they leave behind.
Key Notes
KLA’s Role in Defect Inspection
KLA inspection systems are used across every stage of the semiconductor manufacturing flow:
Their systems are known for balancing sensitivity, speed, and accuracy. Whether it’s a full wafer scan or pinpoint hotspot inspection, KLA has a system tuned to the task.
The product lineup spans optical platforms like the 281x series, advanced electron-beam systems like the eSL10, and integrated solutions that pair inspection with AI-driven classification and design-aware review.
Bright-Field Inspection: The Fab Workhorse
How It Works
KLA’s Bright-Field systems use reflected light to detect defects. A broadband plasma light source shines directly on the wafer. Defect-free areas reflect light evenly, while anomalies scatter or absorb light – showing up as contrast changes.
Systems like the 2810, 2815, and 392x use tunable broadband illumination (DUV through visible), meaning they can adapt the inspection wavelength to the wafer material and layer type, enhancing contrast.
What It’s Great At:
It’s also cost-effective for volume production and widely used in fabs for routine process control.
Limitations
Still, for a huge number of use cases, bright-field inspection gets the job done fast.
E-Beam Inspection: Nanoscale Precision
How It Works
E-Beam inspection fires a focused electron beam at the wafer and measures secondary/backscattered electrons to generate high-resolution images.
Systems like the eSL10 and eDR7380 can detect defects down to 1–3nm.
KLA’s e-beam platforms are built for detail:
Use Cases
E-beam is unmatched in sensitivity, especially for buried defects, voltage contrast, or subtle morphology issues.
Limitations
So while e-beam isn’t for every inspection step, it’s essential for the ones that matter most.
Multi-Beam Inspection: Speed Without Sacrificing Sensitivity
The Industry View
Traditional multi-beam systems use arrays of electron beams scanning in parallel to boost throughput.
But they struggle with calibration, beam overlap, and maintaining resolution across beams.
KLA’s Approach: Single Beam, Smarter Scanning
Instead of going full multi-beam, KLA took a different route:
Why It Matters
This gives fabs a practical way to use e-beam in production without the pain of traditional multi-beam complexity.
You get faster inspection speeds and still detect the smallest, most complex defects.
Side-by-Side Comparison
No single system does it all. Bright-field gets you coverage and speed. E-beam gets you detail. KLA’s hybrid strategy bridges the two.
Data Outputs: What You Get
Bright-Field:
E-Beam:
Together, they give a full picture: where defects are happening, why, and how to stop them.
When to Use What (& Why You Need All Three)
Fabs typically layer inspection strategies:
How AI Enhances KLA Defect Inspection
Most KLA tools still rely heavily on template matching. That works – but it’s limited.
At Averroes.ai, we add an intelligent layer that goes further:
The best part is that it integrates with KLA AOI and e-beam systems without requiring any hardware changes.
So you keep the equipment, but upgrade the intelligence.
Make KLA Defect Inspection Even More Powerful
Achieve 99% accuracy with AI that plugs right in.
Frequently Asked Questions
How does KLA’s inspection approach differ from competitors like Applied Materials or ASML?
KLA focuses heavily on inspection and metrology, with deep investment in both optical and e-beam technologies. Unlike competitors, KLA offers more comprehensive defect classification, stronger integration with design data, and AI insights across its portfolio.
Can KLA systems inspect both front-end and back-end process layers?
Yes, KLA’s platforms are designed to inspect front-side, back-side, and edge defects across all process stages, from initial patterning to final packaging layers, making them suitable for full-flow process monitoring.
Are KLA’s inspection tools compatible with heterogeneous integration or chiplet-based designs?
They are increasingly being adapted for such use cases. Tools like the eSL10 can analyze complex 3D interconnects, high-aspect ratio trenches, and multi-die stacks used in advanced packaging and heterogeneous integration.
How often do fabs need to recalibrate or update KLA inspection recipes?
Recipe tuning typically occurs during process development or when defect trends shift. KLA tools support rapid recipe optimization, and AI helps minimize manual adjustments, but high-volume fabs may still recalibrate periodically for accuracy.
Conclusion
KLA’s defect inspection systems each serve a clear role. Bright-field for speed and full-wafer coverage, e-beam for nanoscale precision, and their multi-beam approach to close the gap between sensitivity and throughput.
None of them are one-size-fits-all, but together they give fabs a layered strategy to catch more defects, faster, and with fewer false alarms.
And when paired with smart AI, the inspection data becomes more than raw output – it becomes a tool for real-time decisions that actually move the needle on yield and efficiency.
If you’re using KLA (or any AOI system), Averroes.ai plugs in to help you cut false positives, reach 99% accuracy, and make better calls without touching your existing setup. Book a free demo to see how.