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Defect Inspection

KLA Defect Inspection: Comparing Bright-Field, Multi-Beam & E-Beam

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Averroes
Jun 25, 2025
KLA Defect Inspection: Comparing Bright-Field, Multi-Beam & E-Beam

KLA’s inspection systems are some of the most widely used in advanced semiconductor manufacturing. And for good reason. 

From bright-field to e-beam, each tool is built to solve a specific inspection challenge. 

But knowing which system to use (and when) isn’t always straightforward. And while their tech is impressive, many still rely on template matching under the hood.

We’ll break down how KLA’s Bright-Field, Multi-Beam, and E-Beam inspection systems compare, where each one fits in the fab, and how integrating AI can close the gaps they leave behind.

Key Notes

  • Bright-field excels at full-wafer coverage but limited to ~20-30nm defect detection.
  • E-beam achieves 1-3nm sensitivity for nanoscale precision but slower throughput.
  • KLA’s single-beam approach outperforms traditional multi-beam complexity and calibration issues.
  • AI integration reduces false positives to <3% without hardware changes.

KLA’s Role in Defect Inspection

KLA inspection systems are used across every stage of the semiconductor manufacturing flow:

  • Incoming tool qualification
  • Wafer qualification
  • R&D and process development
  • Inline line and tool monitoring

Their systems are known for balancing sensitivity, speed, and accuracy. Whether it’s a full wafer scan or pinpoint hotspot inspection, KLA has a system tuned to the task.

The product lineup spans optical platforms like the 281x series, advanced electron-beam systems like the eSL10, and integrated solutions that pair inspection with AI-driven classification and design-aware review.

Bright-Field Inspection: The Fab Workhorse

How It Works

KLA’s Bright-Field systems use reflected light to detect defects. A broadband plasma light source shines directly on the wafer. Defect-free areas reflect light evenly, while anomalies scatter or absorb light – showing up as contrast changes.

Systems like the 2810, 2815, and 392x use tunable broadband illumination (DUV through visible), meaning they can adapt the inspection wavelength to the wafer material and layer type, enhancing contrast.

What It’s Great At:

  • Full-wafer inspection at high throughput
  • Detecting surface defects: particles, scratches, pattern misalignment
  • Inline monitoring, tool qualification, and R&D

It’s also cost-effective for volume production and widely used in fabs for routine process control.

Limitations

  • Resolution limited by the physics of light (~20–30nm defect detection)
  • Can miss buried or electrical defects
  • Less suited for sub-5nm and 3D structures

Still, for a huge number of use cases, bright-field inspection gets the job done fast.

E-Beam Inspection: Nanoscale Precision

How It Works

E-Beam inspection fires a focused electron beam at the wafer and measures secondary/backscattered electrons to generate high-resolution images. 

Systems like the eSL10 and eDR7380 can detect defects down to 1–3nm.

KLA’s e-beam platforms are built for detail:

  • Simul-6™ sensor tech collects six defect signals in one scan: surface, topography, deep trench, and more
  • Yellowstone™ scanning mode processes up to 10 billion pixels/scan
  • SMARTs™ deep learning algorithms analyze defects in real time and reduce false positives

Use Cases

  • Hotspot and critical layer inspection
  • Advanced node inspection (7nm, 5nm, 3nm)
  • R&D and root cause analysis

E-beam is unmatched in sensitivity, especially for buried defects, voltage contrast, or subtle morphology issues.

Limitations

  • Throughput is slower than optical
  • Requires cleanroom environment and vacuum
  • Higher operational complexity and cost

So while e-beam isn’t for every inspection step, it’s essential for the ones that matter most.

Multi-Beam Inspection: Speed Without Sacrificing Sensitivity

The Industry View

Traditional multi-beam systems use arrays of electron beams scanning in parallel to boost throughput. 

But they struggle with calibration, beam overlap, and maintaining resolution across beams.

KLA’s Approach: Single Beam, Smarter Scanning

Instead of going full multi-beam, KLA took a different route:

  • One highly optimized beam with adjustable current (from 200 pA to 40 nA)
  • Yellowstone™ scanning mimics the speed of multi-beam while maintaining single-beam resolution
  • Combined with AI and Simul-6™, it hits the sweet spot between speed and detail

Why It Matters

This gives fabs a practical way to use e-beam in production without the pain of traditional multi-beam complexity. 

You get faster inspection speeds and still detect the smallest, most complex defects.

Side-by-Side Comparison

Feature Bright-Field Multi-Beam (KLA approach) E-Beam (eSL10, eDR7xxx)
Defect Sensitivity ~20–30 nm ~1–3 nm 1–3 nm
Throughput High Moderate to High Low
Use Case Full wafer, fab control Advanced node inline Hotspot, R&D, review
Operational Complexity Low Moderate High
Inspection Type Surface & pattern Nanoscale & 3D Physical, electrical, buried

No single system does it all. Bright-field gets you coverage and speed. E-beam gets you detail. KLA’s hybrid strategy bridges the two.

Data Outputs: What You Get

Bright-Field:

  • Defect maps highlighting surface anomalies
  • Contrast-based images showing particles, scratches, pattern issues
  • Used for trend monitoring, excursion alerts, and tool health

E-Beam:

  • High-res images with nanometer-scale defect morphology
  • Voltage contrast to reveal electrical defects (opens, shorts, voids)
  • Deep insights for failure analysis and process tweaks

Together, they give a full picture: where defects are happening, why, and how to stop them.

When to Use What (& Why You Need All Three)

Scenario Best Fit
Routine fab monitoring Bright-Field
Voltage contrast defects E-Beam
Sub-3nm node process development E-Beam / Multi-Beam
Wafer qualification (full coverage) Bright-Field
Hotspot or critical area inspection E-Beam

Fabs typically layer inspection strategies:

  1. Bright-field for broad coverage
  2. AI to flag suspect wafers or layers
  3. E-beam for deep dive analysis

How AI Enhances KLA Defect Inspection

Most KLA tools still rely heavily on template matching. That works – but it’s limited.

At Averroes.ai, we add an intelligent layer that goes further:

  • Learns from real production data (no reprogramming needed)
  • Reduces false positives to <3%
  • Works with just 20–40 images per defect class
  • Processes results in real time

The best part is that it integrates with KLA AOI and e-beam systems without requiring any hardware changes. 

So you keep the equipment, but upgrade the intelligence.

Make KLA Defect Inspection Even More Powerful

Achieve 99% accuracy with AI that plugs right in.

Frequently Asked Questions

How does KLA’s inspection approach differ from competitors like Applied Materials or ASML?

KLA focuses heavily on inspection and metrology, with deep investment in both optical and e-beam technologies. Unlike competitors, KLA offers more comprehensive defect classification, stronger integration with design data, and AI insights across its portfolio.

Can KLA systems inspect both front-end and back-end process layers?

Yes, KLA’s platforms are designed to inspect front-side, back-side, and edge defects across all process stages, from initial patterning to final packaging layers, making them suitable for full-flow process monitoring.

Are KLA’s inspection tools compatible with heterogeneous integration or chiplet-based designs?

They are increasingly being adapted for such use cases. Tools like the eSL10 can analyze complex 3D interconnects, high-aspect ratio trenches, and multi-die stacks used in advanced packaging and heterogeneous integration.

How often do fabs need to recalibrate or update KLA inspection recipes?

Recipe tuning typically occurs during process development or when defect trends shift. KLA tools support rapid recipe optimization, and AI helps minimize manual adjustments, but high-volume fabs may still recalibrate periodically for accuracy.

Conclusion

KLA’s defect inspection systems each serve a clear role. Bright-field for speed and full-wafer coverage, e-beam for nanoscale precision, and their multi-beam approach to close the gap between sensitivity and throughput. 

None of them are one-size-fits-all, but together they give fabs a layered strategy to catch more defects, faster, and with fewer false alarms. 

And when paired with smart AI, the inspection data becomes more than raw output – it becomes a tool for real-time decisions that actually move the needle on yield and efficiency.

If you’re using KLA (or any AOI system), Averroes.ai plugs in to help you cut false positives, reach 99% accuracy, and make better calls without touching your existing setup. Book a free demo to see how.

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